? The Agilent Medalist x6000 AXI
?system offers extensive simul-
?taneous 3D X-ray inspection of
?double-sided panels at throughput
?rates that match most line rates of
?medium to high complexity printed
?circuit board assemblies (PCBA).
? Provides uncompromised 3D
?inspection for maximum fault
?detection up to 95% of all manu-
?facturing defects.
? Designed for in-line or off-line
?automated X-ray process testing
?of lead or lead-free solder joints
?on PCBAs, with user con?? gurable
?pass-thru or pass-back loading.
? Enables successful implementa-
?tions through an easy-to-learn
?and easy-to-use development
?environment providing faster
?time-to-market with high
?quality results.
? Digital cross-sectional X-ray images
?of solder joints are automatically
?generated and analyzed. The
?dynamic analysis measures joint
?characteristics and compares
?results against both learned and
?user de?? ned thresholds.